| 속성 | 시험 방법 | LCP GF30 (Type II) | LCP Unfilled (Type II) |
|---|---|---|---|
| 밀도 | ISO 1183 | 1.62 g/cm³ | 1.40 g/cm³ |
| 녹는 온도 | ISO 11357 | 280°C | 280°C |
| HDT @ 1.80 MPa | ISO 75 | 240–260°C | 190–210°C |
| Tensile Modulus (flow direction) | ISO 527 | 15,000 MPa | 10,000 MPa |
| Tensile Modulus (transverse) | ISO 527 | 5,000 MPa | 3,000 MPa |
| Tensile Strength (flow direction) | ISO 527 | 180 MPa | 180 MPa |
| Tensile Strength @ 200°C | ISO 527 | ~150 MPa | 해당 사항 없음 |
| 휴식 시 연신율 | ISO 527 | 1.5–2.5% | 1.5–3.0% |
| 굴곡 탄성 계수 | ISO 178 | 13,000 MPa | 9,000 MPa |
| Charpy Notched Impact +23°C | ISO 179/1eA | 15–25 kJ/m² | 20–30 kJ/m² |
| CTE (flow direction) | ISO 11359 | 1–3 × 10⁻⁶/°C | 1–5 × 10⁻⁶/°C |
| CTE (transverse) | ISO 11359 | 15–30 × 10⁻⁶/°C | 25–50 × 10⁻⁶/°C |
| Water Absorption (23°C, 24h) | ISO 62 | < 0.05% | < 0.05% |
| Flammability (UL94) | UL94 | V-0 @ 0.2 mm | V-0 @ 0.2 mm |
| 금형 수축(흐름) | ISO 294-4 | 0.0–0.2% | 0.0–0.3% |
| Mold Shrinkage (transverse) | ISO 294-4 | 0.4–0.7% | 0.5–0.9% |
| Dielectric Constant @ 1 GHz | IEC 60250 | 3.5–4.0 | 3.0–3.5 |
| Dissipation Factor @ 1 GHz | IEC 60250 | 0.005–0.010 | 0.003–0.008 |
LCP vs. PPS vs. PEEK: High-Temperature Thermoplastics Showdown
LCP, PPS, and PEEK are the three most frequently cross-shopped materials in the >200°C thermoplastic space. The table below shows why none of them displaces the others entirely — each material has a performance-cost profile that matches a specific application envelope.
| 속성 | LCP GF30 | PPS GF40 | PEEK 30% GF |
|---|---|---|---|
| 밀도 | 1.62 g/cm³ | 1.65 g/cm³ | 1.49 g/cm³ |
| HDT @ 1.80 MPa | 240–260°C (Type II) 300–350°C (Type I) |
265°C | 315°C |
| Continuous Use Temp | 200–240°C (Type II) 260–300°C (Type I) |
200–220°C | 250°C |
| CTE (flow direction) | 1–3 × 10⁻⁶/°C | 15–25 × 10⁻⁶/°C | 15–25 × 10⁻⁶/°C |
| 200°C에서의 인장 탄성계수 | ~10,000 MPa | ~12,000 MPa | ~8,000 MPa |
| Tensile Strength @ 200°C | ~150 MPa | ~130 MPa | ~120 MPa |
| Impact Toughness @ RT | Low (15–25 kJ/m²) | Moderate (25–40 kJ/m²) | High (50–70 kJ/m²) |
| 가연성 | V-0 inherent (no additives) | V-0 (with additives) | V-0 (with additives) |
| 수분 흡수 | < 0.05% | 0.03% | 0.1% |
| 내화학성 | Excellent (acids, solvents) | Excellent (nearly universal below 200°C) | Excellent (except strong acids) |
| Weld Line Strength | Poor (inherently weak) | 공정 | Good |
| Wall Thickness Minimum | 0.1 mm | 0.3 mm | 0.5 mm |
| Processing Temp | 300–350°C | 320–340°C | 380–400°C |
| Mold Temp | 80–120°C | 130–150°C | 170–200°C |
| Relative Cost / kg | $$$ | $$ | $$$$ |
| 최상의 대상 | Ultra-thin-wall electronics, CTE-critical, SMT | Chemical plant, hot water, structural | Maximum toughness, medical implants, structural aerospace |
Decision Rules
- Choose LCP when: You need CTE near steel (1–3 ppm/°C), walls thinner than 0.3 mm, or inherent V-0 without property trade-offs. Electronics connectors, SIM trays, and 5G antenna substrates are LCP’s home turf.
- Choose PPS when: Chemical resistance is paramount (especially hot water, steam, or aggressive acids at 150°C+), you need better toughness than LCP, and CTE is less critical. PPS is also roughly 30–40% cheaper per kilogram than LCP.
- Choose PEEK when: Toughness is non-negotiable, continuous use approaches 250°C, or biocompatibility is required. PEEK is the only option in this group for load-bearing medical implants, and it tolerates steam sterilization better than either LCP or PPS.
LCP Commercial Grade Selector
| 제조사 | 브랜드 | 등급 | GF % | 유형 | 주요 기능 | 일반적인 애플리케이션 |
|---|---|---|---|---|---|---|
| 셀라네즈 | Vectra | A130 | 30% | II | General-purpose GF30, standard flow | Connectors, bobbins, coil forms |
| 셀라네즈 | Vectra | E130i | 30% | II | Improved weld-line strength, higher toughness | Complex connector geometries |
| 셀라네즈 | Vectra | A150 | 50% | II | Maximum stiffness, lowest shrinkage | High-rigidity structural electronics |
| 셀라네즈 | Vectra | A230 | 30% carbon fiber | II | Conductive, high stiffness | ESD-sensitive electronics |
| 셀라네즈 | Vectra | E820i Pd | 40% (GF+mineral) | II | Platable grade, LDS-compatible | 3D-MID circuits, antenna substrates |
| 셀라네즈 | Vectra | E830i Pd | 30% GF | II | Platable, FDA compliant | 의료기기 하우징 |
| 셀라네즈 | Zenite | 6130L | 30% | II | Low warp, balanced flow | SMT connectors, DDR sockets |
| 셀라네즈 | Zenite | 6145L | 45% | II | Low warp, high stiffness | Long, thin connectors |
| 폴리플라스틱스 | Laperos | A130 | 30% | II | 표준 GF30, 고유량 | Consumer electronics |
| 솔베이 | Xydar | G-930 | 30% | I | Type I GF30 — 300°C+ HDT | Oven components, aerospace connectors |
| 솔베이 | Xydar | G-945 | 45% | I | Type I max stiffness | High-temp structural |
| Sumitomo | SUMIKASUPER | E6000 | 30% | II | Ultra-low dielectric for 5G | 5G antenna substrates, mmWave |
| Toray | Siveras | LX70G30 | 30% | II | Improved toughness GF30 | USB-C connectors, camera modules |
Processing LCP: Injection Molding Parameters
| 매개변수 | 권장 값 | 참고 |
|---|---|---|
| 예건 | 140–160°C for 4 hours | 제습기 필요. 목표 수분 함량 < 0.01% |
| 용융 온도 | 300–350°C | Type II grades; Type I requires 350–400°C |
| 금형 온도 | 80–120°C | Lower than PPA or PEEK — water-heated molds often sufficient |
| 주입 속도 | 빠른 | LCP solidifies rapidly — fill speed is critical for thin walls |
| 압력 유지 | 40–60 MPa | LCP shrinkage is near-zero in flow direction; pack lightly |
| 체류 시간 | Minimize (≤ 10 min) | LCP is thermally stable but extended residence reduces properties |
Critical processing insights:
- Weld lines are the Achilles’ heel: LCP’s highly oriented molecular structure creates inherently weak weld lines — strength at a weld line can be 30–50% of the bulk value. Gate placement is more consequential for LCP than for any other engineering thermoplastic. When possible, design parts to avoid weld lines in load-bearing regions, or use multi-gate sequential valve gating to knit fronts under pressure.
- Drying is mandatory: Although LCP absorbs almost no water at room temperature, any surface moisture on pellets hydrolyzes the polymer at 330°C. The 0.01% moisture target is stricter than for most engineering polymers.
- Anisotropy is designed-in: LCP’s mechanical properties are inherently anisotropic — strong in the flow direction, weaker transversely. Part design must account for this. Where isotropy is needed, consider mineral-filled or specialty grades, but expect a stiffness penalty.
- Low shrinkage, high precision: Near-zero shrinkage in the flow direction means LCP molds can hold extraordinarily tight tolerances — but this also means the mold cavity must be cut to essentially final dimensions. No “sizing factor” allowance like with polyolefins.
- Fast cycle times: LCP solidifies almost instantly upon contacting the mold wall. Cycle times of 2–5 seconds for small electronic connectors are routine — this is LCP’s single greatest processing advantage.
Key LCP Applications
| 산업 | 신청 | Driving Property |
|---|---|---|
| 소비자 가전 | SIM card trays, USB-C connectors, DDR memory sockets, camera module housings | Thin-wall (0.1–0.3 mm), V-0, survives reflow, CTE match to copper |
| 5G / Telecommunications | Antenna substrates, mmWave lens arrays, base station connector bodies | Low Dk/Df at GHz frequencies, dimensional stability |
| 자동차 | Ignition coil bobbins, transmission speed sensors, relay bases | Heat resistance, oil resistance, electrical insulation |
| 의료 | Surgical instrument handles, dental tool bodies, catheter components | Steam sterilizable, chemical resistance, dimensional precision |
| Fiber Optics | Optical fiber connectors (MT, MPO ferrules), alignment sleeves | CTE match to glass fiber, micromolding precision |
| 항공우주 | High-temperature connector inserts, waveguide components, radome structures | Type I grades: 300°C+ service, low outgassing, lightweight |
| 산업 | Pump wear rings, chemical valve seats, bearing cages (high-temp) | Chemical resistance at 150°C+, dimensional stability in aggressive media |
LCP Limitations
- Weld line weakness: This cannot be overstated. If your part has converging melt fronts in a stressed area, LCP is probably not the right material. Weld line strength in LCP is worse than PPS, far worse than PA66.
- Low impact toughness: Unfilled and GF LCP grades are inherently brittle. Charpy notched values of 15–25 kJ/m² make them unsuitable for snap-fit applications or parts subject to impact loads.
- Anisotropic properties: Tensile modulus can vary 3:1 between the flow direction and transverse direction. This is manageable when the mold designer knows it, but problematic if the part was designed for an isotropic material.
- Cost: LCP costs 3–6× a standard PA66 GF30 and roughly 2× PPS GF40. You are paying for the unique combination of CTE, thin-wall capability, and inherent V-0.
- Limited colorability: LCP is typically black or natural. Light colors are difficult due to the high processing temperatures.
- Notch sensitivity: LCP’s sharp notches propagate cracks readily. Avoid sharp internal corners in part design.
What Is LCP?
LCP (Liquid Crystal Polymer) occupies a unique position in the engineering polymers hierarchy. It is not a nylon, not a polyester in the conventional sense, and not a filled compound — LCP is a wholly aromatic polyester that forms ordered, rod-like molecular structures in the melt state. When LCP flows into a mold, those rigid molecular rods align along the flow direction, giving the molded part an effect analogous to self-reinforcement: tensile modulus and strength along the flow axis far exceed what the resin’s density and composition suggest.
The practical result: HDT values exceeding 300°C, thermal expansion coefficients comparable to steel (1–3 × 10⁻⁶/°C), wall-thickness capability down to 0.1 mm, and inherent UL94 V-0 flammability without additive loading. No other thermoplastic combines this set of properties at LCP’s price point.
For engineers and buyers searching for LCP datasheets, Vectra vs Zenite grade comparisons, LCP vs PPS vs PEEK selection guidance, or LCP thin-wall molding parameters, this page consolidates the key specifications, grades, processing windows, and application data.
LCP Type Classification: I, II, III
The LCP family is divided into three types based on heat deflection temperature (HDT), which is driven by the monomer chemistry and resulting backbone rigidity.
| 유형 | HDT Range (°C) | Base Chemistry | Example Brand | 주요 기능 | Typical Use |
|---|---|---|---|---|---|
| Type I | 250–350 | Para-hydroxybenzoic acid + biphenol + terephthalic acid | Xydar (Solvay), Ekonol | Highest heat resistance, can survive 300°C+ continuous | Ovenware, aerospace, high-temp connectors |
| Type II | 180–240 | Para-hydroxybenzoic acid + 6-hydroxy-2-naphthoic acid | Vectra (Celanese), Zenite (Celanese) | Best balance of processability, properties, and cost | Electronics connectors, SMT, 5G components |
| Type III | 60–210 | Ethylene terephthalate + para-hydroxybenzoic acid | X7G, Rodrun | Lowest cost, lowest heat — used where flow matters more than T | Thin-wall consumer goods, fibers |
In practice, Type II (Vectra/Zenite) dominates commercial injection molding — roughly 80% of LCP consumption falls here. Type I is reserved for the highest-temperature applications where cost is secondary. Type III has largely been displaced by Type II as processors gained experience with the higher-temperature grades.
LCP GF30 Typical Properties
자주 묻는 질문
What does LCP stand for in plastics?
LCP stands for Liquid Crystal Polymer. The name comes from the material’s unique behavior: even in the molten state, LCP molecules maintain a degree of orientational order (a “liquid crystalline” phase), unlike conventional polymers whose molecules are randomly coiled when melted. This liquid-crystalline melt structure is what gives LCP its extreme flowability, self-reinforcing properties, and low thermal expansion.
What is the difference between LCP Type I, II, and III?
The three types are distinguished by heat deflection temperature (HDT): Type I (250–350°C, e.g., Xydar) for the highest-temperature applications like aerospace; Type II (180–240°C, e.g., Vectra, Zenite) for general-purpose electronics and automotive, which represents the majority of commercial LCP consumption; and Type III (60–210°C, e.g., X7G) which is a lower-cost variant now mostly displaced by Type II.
Is LCP better than PEEK?
“Better” depends on the requirement. LCP has higher flow-direction stiffness at 200°C, lower CTE (1–3 vs. 15–25 ppm/°C), faster cycle times (2–5 seconds vs. 30+ seconds), and lower per-kilogram cost than PEEK. PEEK has dramatically better impact toughness (50–70 vs. 15–25 kJ/m²), higher continuous-use temperature (250°C vs. 200–240°C), and weld line strength far exceeding LCP. If your part has converging melt fronts under load, choose PEEK. If it’s a thin-wall electronic connector needing CTE match and V-0, LCP wins.
Can LCP replace metal?
In specific applications, yes. LCP’s CTE of 1–3 × 10⁻⁶/°C matches steel and copper better than any other unfilled thermoplastic. This is why LCP has replaced metal in SIM card trays, camera module housings, and optical fiber ferrules — the part maintains dimensional compatibility with metal and glass components across assembly and operating temperatures.
Does LCP absorb water?
No — and this is one of LCP’s defining advantages. Water absorption is below 0.05%, meaning LCP parts neither swell in humid environments nor require conditioning before use. Combined with its near-zero flow-direction mold shrinkage, this makes LCP the go-to material for parts that must arrive at assembly with tight tolerances regardless of shipping or storage humidity.
What is the maximum temperature for LCP?
Type II LCP (Vectra/Zenite) has a continuous-use rating of 200–240°C, with short-term excursions to 260°C for lead-free reflow soldering. Type I LCP (Xydar) can sustain 260–300°C continuous. The melting point for Type II is approximately 280°C; for Type I it exceeds 350°C.
Need LCP pellets, Vectra or Zenite datasheets, or help selecting the right LCP grade? We supply GF-carbon, platable, and low-warp LCP grades from Celanese, Polyplastics, and Sumitomo. Contact us with your part geometry, temperature, and electrical requirements.
자주 묻는 질문
LCP가 다른 엔지니어링 플라스틱과 다른 점은 무엇인가요?
액정 고분자(LCP)는 성형 과정에서 자체 보강되는 독특한 강성 막대형 분자 구조를 가지고 있어, 일부 금속에 필적하는 유동 방향 특성을 나타냅니다. 또한 초고도의 내화학성을 갖추고 있으며, 수분 흡수율은 거의 제로에 가깝습니다 (<0.03%), and exceptional thin-wall flowability — enabling wall sections as thin as 0.2mm.
전자 분야에서 LCP의 주요 용도는 무엇인가요?
LCP는 고주파 커넥터(5G, USB-C), 미세 피치 SMT 커넥터, 릴레이 부품 및 스마트폰 내부 구조 부품에 주로 사용되는 소재입니다. GHz 대역에서 낮은 유전율(3.0~3.5)과 낮은 손실 계수를 나타내므로 고속 신호 무결성을 확보하는 데 이상적입니다.
Vectra LCP와 Zenite LCP는 어떻게 다른가요?
Vectra(셀라니즈)와 Zenite(듀폰/셀라니즈)는 모두 열변성 LCP 제품군입니다. Vectra A-시리즈는 HDT가 약 280°C인 범용 등급입니다. 제나이트(Zenite) 등급은 주로 복잡한 다중 게이트 금형에서 용접선 강도를 높이고 유동성을 개선하도록 배합됩니다. 두 제품군 모두 유사한 기본 특성을 제공하지만, 등급별로 장단점이 있습니다.
LCP를 의료 분야에 사용할 수 있나요?
네, 특정 LCP 등급은 단기적인 환자 접촉에 대한 USP Class VI 및 ISO 10993 생체적합성 요건을 충족합니다. 이러한 소재는 수술 기구, 약물 전달 장치 부품 및 치과용 기구에 사용됩니다. LCP는 열화 없이 반복적인 오토클레이브 멸균을 견딜 수 있는 특성을 가지고 있으며, 이는 다른 많은 고분자 소재에 비해 갖는 주요 장점입니다.
Last updated: June 2026. Datasheet values are typical. Always verify specific grade properties with the manufacturer’s current technical data sheet. Vectra and Zenite are registered trademarks of Celanese. Xydar is a registered trademark of Solvay. PEEK is a registered trademark of Victrex. PPS is sold under various trademarks including Ryton (Solvay) and Fortron (Celanese).
